Tag Archive for Thermal Imagery

The MagPi, Issue 76

The MagPi Issue 76There’s no missing my contribution to this month’s The MagPi: it’s plastered all over the cover. The launch of the Raspberry Pi 3 Model A+ ends a four-year absence of the compact form factor from the Raspberry Pi line-up, and there’s no better way to celebrate its launch than with a massive cover feature.

The spread begins with a two-page introduction dominated by imagery of the board, before moving on to a plan view which calls out the individual components that make up the board – including the single USB port, BCM2387B0 system-on-chip (SoC), and the radio which, for the first time in a Model A variant, adds WiFi networking and Bluetooth connectivity. Each part includes macro photography, all taken in my in-house studio.

The next section of the feature runs through a series of benchmarks which, in-keeping with previous launches I’ve covered, compares the Pi 3A+ with other mainstream Pi models going all the way back to the original Raspberry Pi Model B. The feature also includes a look at the size and weight, the first time I’ve used that particular metric, along with comparative thermal imagery showing how the smaller surface area of the PCB copes with running the same high-performance processor as the larger Pi 3B+ – again, all captured in-house.

Finally, the cover feature closes with a two-way interview I conducted with project co-founder Eben Upton and principal hardware engineer Roger Thornton. In it, Eben confirms that the Pi 3A+ represents “tidying up ‘classic’ Raspberry Pi,” and that the Raspberry Pi 4 – still very much on the drawing board – will launch a whole new era for the low-cost single-board computer family.

The launch issue is available now from your nearest newsagent or supermarket in print, or can be downloaded free of charge under a Creative Commons licence from the official website.