This month’s The MagPi, the official Raspberry Pi magazine, includes a hefty spread taking a look at the newly-launched Raspberry Pi Compute Module 4 – bringing the power of the Broadcom BCM2711 to the Compute Module form factor for the first time.
Well, sort of: the new Raspberry Pi Compute Module 4 is actually a wholly new form factor, ditching the old SODIMM edge connector in favour of two high-density connectors on the underside. While that means no backwards compatibility with existing Compute Module carrier boards, third parties have stepped up and launched interposer boards to let you squeeze the new board into old designs.
Having been provided with pre-release access to the Compute Module 4 and its IO Board, my launch feature takes a look at the physical layout and the components that go into the board – with macro photography, including coverage of the high-performance eMMC storage on-board selected models – and runs through a selection of benchmarks testing everything from synthetic and real-world performance to footprint and weight.
One particularly interesting aspect of the benchmarking, and one which will inform designs based around the new module, was thermal throttling analysis: the Raspberry Pi 4 is known to run reasonably hot, though enhancements since launch have brought the temperature down considerably, and moving the same technology into a smaller footprint means the Compute Module 4 gets toasty warm. As Raspberry Pi Foundation founder Eben Upton explained, passive cooling is going to be a must for most designs.